D.18.1 Forum for Access to Specialty Tools in IRMS
Description
The purpose of this section is to describe some of the specialty tools available in academia that can be accessed by colleagues in academia and industry. Click on one of the sortable column headings to alphabetize by that parameter.
Tools in Academia
| University | Faculty Member | IRMS Tool | Turn-around time |
|---|---|---|---|
| UT Dallas | Walter Voit | Dynamic Mechanical Analyzer (DMA) | 2–3 weeks |
| UT Dallas | Walter Voit | Differential Scanning Calorimeter (DSC) | 2–3 weeks |
| UT Dallas | Walter Voit | Thermogravimetric Analysis (TGA) | 2–3 weeks |
| UT Dallas | Walter Voit | Cleanroom Characterization and Metrology | 4–8 weeks |
| UT Dallas | Walter Voit | Cleanroom Deposition | 4–8 weeks |
| UT Dallas | Walter Voit | Cleanroom Lithography | 4–8 weeks |
Specifications
Dynamic Mechanical Analyzer (DMA)
- Mettler-Toledo
- .001 Hz to 1000 Hz
- −70 C to 550 C
- Modes: Shear, Liquid Shear, Compression, Tension, Compression, 3 pt. bend, 4 pt. bend, single cantilever, dual cantilever
- Sample size dependent on specific test, but typically mg to g
Differential Scanning Calorimeter (DSC)
- Mettler-Toledo
- −70 C to 550 C
- 7 mg to 10 mg sample size
- more than 50 thermocouples to give quantitative measurements of thermal transitions
- endotherms, exotherms, crystallinity, curing profiles, etc.
Thermogravimetric Analysis (TGA)
- Mettler-Toledo
- 7 mg to 10 mg sample size
- char yield, water in sample, oxidative degradation
- samples can be run in Argon, air, Nitrogen, or specialty gasses upon request
- ability to trap volatiles and run through elemental analysis and Fourier transform infrared (FTIR) spectroscopy
- −50 C to 1000 C
Cleanroom Characterization and Metrology
- UT Dallas Cleanroom Tools
- Leica INM 200 Optical Microscope
- Leica INM 100 Optical Microscope
- Zeiss Supra 40 Scanning Electron Microscope
- Veeco Dimension 5000 SPM
- Sentech Ellipsometer
- Jandel Multiposition Wafer Probe
- Alessi 4-Point Probe
- Thermo Electron FTIR Spectrometer w/Ge ATR
- TOHO FLX2320 Thin Film Stress Measurement
- Veeco Dektak VIII Prolifometer
- Nanometrics Nanospec Film Thickness
- Rame-Hart Goniometer
Cleanroom Deposition
- UT Dallas Cleanroom Tools
- Tystar LPCVD Furnace
- Plasma-Therm 790 PECVD
- Ultratech/Cambridge NanoTech Savannah 100 Atomic Layer Deposition
- SCS Parylene Deposition
- Cryo-evaporator e-gun Deposition
- Temescal e-gun Deposition
- CHA Mark 50 e-gun Evaporator
- Hummer VI Sputter (for SEM samples)
- AJA 1500 Sputter
- AJA Orion Sputter
Cleanroom Lithography
- UT Dallas Cleanroom Tools
- Heidelberg DWL66 Laser Writer
- Quintel Q4000-6 Contact Printer
- Karl Suss MA6B Contact Printer
- Obducat Nano-Imprinter NIL-2.5″ Imprint
- Ultratech Mask Cleaner
- CEE Spin Coater
- Headway Spinner
- CPK Chrome Etch & Base Develop
- CPK Solvent Develop
- Blue M Ovens
- Cole Parmer Ovens
- HMDS
- Cole Parmer Digital Hot Plates
- TPS Digital Hot Plates
- Raith 150-TWO E-Beam Litho